A new technical paper titled “DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design” was published (preprint) by researchers at UCSB and Cadence. “Thermal issue is a major ...

The use of Artificial Intelligence (AI) into 3D product design is increasingly impactful, especially during the initial stages of image creation, brainstorming and conceptualization. A variety of AI ...

Discover how 3D-printable aluminium from MIT delivers extreme strength and heat resistance. Read the full story.

3D Visualization Lecturers: 3D Visualization professionals are invited to RIT to lead lectures, discussions, and demos that give you an informed industry perspective. Industry Networking: Take part in ...

Spline, a no-code design tool for creating 3D assets, today announced that it raised $15 million in a seed round led by Gradient Ventures with participation from First Round Capital, NXTP, Chapter One ...