FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
The global electroplating market size is projected to reach $27.2 billion by 2032, growing at a CAGR of 4% from 2023 to 2032 WILMINGTON, DE, UNITED STATES, June 25, 2025 /EINPresswire / -- Allied ...
HSINCHU, Taiwan--(BUSINESS WIRE)--Mycropore Corporation Ltd., a leading Taiwan-based supplier of micro-contamination control and filtration solution provider for advanced semiconductor industry, today ...
Victory PCB, a professional printed circuit board manufacturer based in Shenzhen, today announced its continued focus on the production and supply of Heavy Copper Printed Circuit Boards (PCBs), ...
VTT Technology Research Centre to use ClassOne Solstice S8 for advanced packaging This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer ...
In this paper, we describe a technique to prepare a copper layer on polyimide film using a polymer nanosheet as a nano-adhesion. We employ two kinds of functional polymer nanosheets: one works as an ...
The electroplating intermediate is a material used in the electroplating process to adjust characteristics such as grain size, gloss, thickness and plating speed. Most of them are configured as ...
A highly transparent, flexible, stretchable and patternable copper fiber heater was successfully fabricated for potential use in smart windows and other applications. The thickness of the electrospun ...
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