TEMPE, Ariz., May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies today announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s ...
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...
PLAINVIEW, N.Y., Aug. 14, 2024 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) today announced that IBM selected the WaferStorm® Wet Processing System for Advanced Packaging applications and ...
Canada is investing up to $210 million through the Strategic Response Fund to back a $662 million initiative that will expand semiconductor packaging and commercialization capacity at IBM Canada’s ...
Nestlé is collaborating with IBM Research to create advanced tools that harness AI and advanced technology to develop a generative AI system capable of discovering innovative high-barrier packaging ...
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