SANTA CLARA, Calif. — Officials with Taiwanese IC-packaging and test giant Advanced Semiconductor Engineering Inc. (ASE) here outlined a bold strategy to enter the China market, telling SBN that the ...
SHANGHAI — In a move to expand its efforts in China, Intel Corp. here set plans to build a new chip-assembly plant in Shanghai geared for its Pentium 4 microprocessor lines, according to a report from ...
ASE Technology Holding (ASEH) is expected to see its revenue rebound substantially in March after reaching a low point in February, as the OSAT continues to offload "wafer bank" inventories ...
The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...
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