India's semiconductor ambitions are beginning to extend beyond fabrication and conventional packaging into secure chip ...

Apple is reportedly in exploratory conversations with at least one partner to potentially handle iPhone chip assembly and packaging in India for the first time. Here are the details. According to The ...

Tata Group and Intel announced on December 8 that they have signed a memorandum of understanding to explore cooperation across semiconductor manufacturing, packaging and AI-focused computing systems ...

Mitsubishi Electric India has started discussions with a few Indian outsourced semiconductor assembly and test (OSAT) and advanced test and packaging (ATMP) companies to explore supplying its silicon ...