Many companies employ some kind of inspection to verify process steps within their surface-mount technology (SMT) lines. Because solder-paste volume is an important predictor of solder-joint quality ...
In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...
"Single Lane - SPC Statistical Process Control - Germany IDS 5.3M Pixel -Machine Customisation is available 3D SPI Specification: Model EKT-8060A Board Handling PCB Size Min: 55*55mm – Max: 400*350mm ...
Key Companies Covered in the 3D Solder Paste Inspection (SPI) System Market Research are MirTec Ltd, Pemtron, CyberOptics Corporation, Koh Young, PARMI Corp, Test Research, Inc (TRI), Vi TECHNOLOGY, ...
MINNEAPOLIS--(BUSINESS WIRE)-- CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will unveil the new Dual-Mode MRS ...
In this interview, Tim Skunes from CyberOptics Corporation talks to AZoM about their 3D optical inspection technology, and how it can be used to solve challenges in SMT electronics manufacturing.
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets. 3D Multiple Reflection Suppression (MRS) sensor ...
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