A new top-cool packaging approach is reshaping thermal management in power-hungry systems, promising cooler, more efficient, ...

A new technical paper titled “Advances in Two-Phase Cooling for Next Power Electronics Converters” was published by researchers at ROMA TRE University, ENEA Casaccia Research Center and Sapienza ...

AI data centers are racing toward power levels that look less like server rooms and more like industrial plants, and their electrical infrastructure is straining to keep up. Into that crunch steps an ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...

The field of cryogenic power electronics explores the enhancement of power conversion devices through operation at extremely low temperatures. By utilising cryogenic cooling methods (typically ...

The "The Global Power Electronics Market 2026-2036" has been added to ResearchAndMarkets.com's offering. The global power electronics market is projected to grow with a CAGR exceeding 8%, adding over ...

As the global energy landscape rapidly transforms, High-Voltage Direct Current (HVDC) technology is emerging as a cornerstone of modern transmission systems. HVDC converter stations are enabling ...

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...

With artificial intelligence and quantum computing driving the need for more powerful servers, data center engineers need to juggle increasing data handling needs with higher power density and, ...

A layer of graphene can reduce the working temperature in hotspots inside a processor by up to 25 percent – which can significantly extend the working life of computers and other electronics. An ...

A high-density dc-dc converter can deliver substantial power, but only if excessive heat is removed by transferring internal heat through a number of material interfaces to a surface exposed to the ...