Digi Times

Smiths Interconnect secures significant strategic win with leading high-performance AI semiconductor chip provider

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented, state-of-the-art ...
Digi Times

Smiths Interconnect's DaVinci 112 high-speed test socket wins best test measurement award at the 2024 Global Electronics Achievement Awards

Smiths Interconnect is thrilled to announce that its DaVinci 112 high-speed test socket received the prestigious Best Test Measurement Award of the Year at the Global Electronics Achievement Awards ...
Semiconductor Engineering

Enhancing Test Socket Performance Through Application-Specific Validation And System-Level Per-Pin OQC

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
Semiconductor Engineering

Comparison Of State-Of-The-Art Models For Socket Pin Defect Detection

This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ, by Vijayakumar Thangamariappan, Nidhi Agrawal, Jason Kim, Constantinos Xanthopoulos, Ira Leventhal, and Ken Butler, ...
Electronic Design

9-GHz Test Sockets Work With All BGA Package Sizes

Semiconductor devices housed in BGAs and µBGAs having up to 2,500 pins and running at speeds well beyond today's fastest ICs can all be tested, debugged and programmed using a series of ...
EDN

Test sockets fit high-frequency apps

The high-frequency Center Probe and CSP/MicroBGA test and burn-in sockets are now offered in sizes up to 6.5-mm2 with pitches down to 0.3 mm to enable the testing of smaller components. The sockets ...