A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...

The SG-BGA-7199 socket isdesigned for 13.5 x 8 x 1.2mm package size and operates at bandwidths up to 10GHz with less than 1dB of insertion loss. The contact resistance is typically20 milliohms per I/O ...

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.

The estimated revenue of Taiwan's IC design industry in 2022 totalled at a commanding US$40 billion. The sector has proven itself to be eminently high-yielding with an enviable average profit margin ...

When analyzing the supply and demand of global semiconductor design talents in 2021, one finds US-based companies to be the main source of chip design demand. US-based companies accounted for 43% of ...

At last month’s Fabless Semiconductor Association (FSA) Awards (the FSA is now the Global Semiconductor Association, or GSA), Gordon Campbell, recipient of the Dr. Morris Chang Exemplary Leadership ...