Scientists from Nagoya University in Japan have developed an innovative cooling device—an ultra-thin loop heat pipe—that significantly improves heat control for electronic components in smartphones ...

Fujitsu has developed a new cooling solution aimed at compact electronic devices. The new heatpipe cooler design, measuring just 1mm at its thickest is said to be "capable of transferring ...

With a thickness of just 0.3 mm, the new UTLHP fits within slim modern phones without making them heavier, works effectively regardless of how you hold your phone, and can handle heat levels for ...